DSpace Collection:
http://142.54.178.187:9060/xmlui/handle/123456789/669
2024-03-28T10:11:21ZA Hybrid Approach Toward Research Paper Recommendation Using Centrality Measures and Author Ranking
http://142.54.178.187:9060/xmlui/handle/123456789/1228
Title: A Hybrid Approach Toward Research Paper Recommendation Using Centrality Measures and Author Ranking
Authors: Waheed, Waleed; Imran, Muhammad; Raza, Basit; Malik, Ahmad Kamran; Khattak, Hasan Ali
Abstract: The volume of research articles in digital repositories is increasing. This spectacular growth of repositories makes it rather difficult for researchers to obtain related research papers in response to their queries. The problem becomes worse when a researcher with insufficient knowledge of searching research articles uses these repositories. In the traditional recommendation approaches, the results of the query miss many high-quality papers, in the related work section, which are either published recently or have low citation count. To overcome this problem, there needs to be a solution which considers not only structural relationships between the papers but also inspects the quality of authors publishing those articles. Many research paper recommendation approaches have been implemented which includes collaborative filtering-based, content-based, and citation analysis-based techniques. The collaborative filtering-based approaches primarily use paper-citation matrix for recommendations, whereas the content-based approaches only consider the content of the paper. The citation analysis considers the structure of the network and focuses on papers citing or cited by the paper of interest. It is therefore very difficult for a recommender system to recommend high-quality papers without a hybrid approach that incorporates multiple features, such as citation information and author information. The proposed method creates a multilevel citation and relationship network of authors in which the citation network uses the structural relationship between the papers to extract significant papers, and authors' collaboration network finds key authors from those papers. The papers selected by this hybrid approach are then recommended to the user. The results have shown that our proposed method performs exceedingly well as compared with the state-of-the-art existing systems, such as Google scholar and multilevel simultaneous citation network.2019-02-28T00:00:00ZEfficient and scalable cross-by-pass-mesh topology for networks-on-chip
http://142.54.178.187:9060/xmlui/handle/123456789/1227
Title: Efficient and scalable cross-by-pass-mesh topology for networks-on-chip
Authors: Gulzari, Usman Ali; Anjum, Sheraz; Aghaa, Shahrukh; Khan, Sarzamin
Abstract: This study presents an efficient and scalable networks-on-chip (NoC) topology termed as cross-by-pass-mesh (CBP-Mesh). The proposed architecture is derived from the traditional mesh topology by addition of cross-by-pass links in the network. The design and impact of adding cross-by-pass links on the topology is analysed in detail with the help of synthetic, hotspot as well as embedded traffic traces. The advantages of proposed CBP-Mesh as compared with its competitor topologies include reduction in the network diameter, increase in bisection bandwidth, reduction in average numbers of hops, improvement in symmetry and regularity of the network. The synthetic traffic traces and some real embedded system workloads are applied on the proposed CBP-Mesh and its competitor two-dimensional-based NoC topologies. The comparison of analytical results in terms of performance and costs for different network dimensions indicate that the proposed CBP-Mesh offers short latency, high throughput and good scalability at small increase in power and energy.2017-06-27T00:00:00ZModeling and Analysis of the Thermal Properties Exhibited by Cyberphysical Data Centers
http://142.54.178.187:9060/xmlui/handle/123456789/1226
Title: Modeling and Analysis of the Thermal Properties Exhibited by Cyberphysical Data Centers
Authors: Malik, Saif U. R.; Bilal
Abstract: Data centers (DCs) contribute toward the prevalent application and adoption of the cloud by providing architectural and operational foundation. To perform sustainable computation and storage, a DC is equipped with tens of thousands of servers, if not more. It is worth noting that the operational cost of a DC is being dominated by the cost spent on energy consumption. In this paper, we model a DC as a cyberphysical system (CPS) to capture the thermal properties exhibited by the DC. All software aspects, such as scheduling, load balancing, and all the computations performed by the devices, are considered the “cyber” component. The supported infrastructure, such as servers and switches, are modeled as the “physical” component of the CPS. We perform detailed modeling of the thermal characteristics displayed by the major components of the CPS. Moreover, we propose a thermal-aware control strategy that uses a high-level centralized controller and a low-level centralized controller to manage and control the thermal status of the cyber components at different levels. Our proposed strategy is testified and demonstrated by executing on a real DC workload and comparing it with three existing strategies, i.e., one classical and two thermal-aware strategies. Furthermore, we also perform formal modeling, analysis, and verification of the strategies usin2015-12-22T00:00:00ZLaser prototyping of multilayer LTCC microwave components for system-in-package applications
http://142.54.178.187:9060/xmlui/handle/123456789/1224
Title: Laser prototyping of multilayer LTCC microwave components for system-in-package applications
Authors: Shafique, M.F.
Abstract: This study describes the fabrication of multilayer microwave components in low temperature co-fired ceramic (LTCC) technology using a laser prototyping method that requires no masks or photolithographic steps. Multilevel inductors, metal-insulator-metal capacitors and substrate integrated waveguides (SIWs) have been demonstrated. Optimisation of the laser machining parameters for the fabrication of microvias and micro-channels for the components is investigated. Using a 1064-nm IR laser, vias and channels with widths smaller than the thickness of the substrate have been achieved using the proposed multi-step process. Microvias with a diameter and separation of 75 and 50--m, respectively, have been realised by optimising the laser fluence and processing cycles. Micro-channels having widths of 30-100--m have also been demonstrated and used as the side walls for SIWs. The proposed fabrication technique offers a useful method for the rapid prototyping of multilayer LTCC modules.2011-06-30T00:00:00Z