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Please use this identifier to cite or link to this item: http://142.54.178.187:9060/xmlui/handle/123456789/1764
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dc.contributor.authorJabbar, M.-
dc.contributor.authorNawab, Y.-
dc.contributor.authorAshraf, M.-
dc.contributor.authorShaker, K.-
dc.date.accessioned2019-11-22T10:52:03Z-
dc.date.available2019-11-22T10:52:03Z-
dc.date.issued2015-01-13-
dc.identifier.isbn978-1-4799-6369-0-
dc.identifier.urihttp://142.54.178.187:9060/xmlui/handle/123456789/1764-
dc.description.abstractFor manufacturing of long life and sustainable materials, self-healing composites are an emerging concept. Mixing of resin with microcapsules containing healing agent is the best way to achieve this purpose. Curing of composites during thermal cycle leads to rise in temperature at core due to entrapment of heat of reaction and it may cause degradation of mixed capsules. In the present work thermal stability of microcapsules during fabrication of unidirectional thermoset carbon/epoxy self-healing composite is studied. For this purpose heat transfer coupled with cure kinetics and structural mechanics equation are solved using finite element methods. Analysis of samples, having thickness in the range 2mm-60mm, provides the information if capsules in the composite degrade as well as the quantity of degraded capsules.en_US
dc.language.isoen_USen_US
dc.publisherIEEE 12th International Bhurban Conference on Applied Sciences and Technology (IBCAST)en_US
dc.subjectEngineering and Technologyen_US
dc.subjectThermal stabilityen_US
dc.subjectPolymersen_US
dc.subjectHeatingen_US
dc.titleNumerical analysis of self-healing composite materialsen_US
dc.typeProceedingsen_US
Appears in Collections:Proceedings

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