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Please use this identifier to cite or link to this item: http://142.54.178.187:9060/xmlui/handle/123456789/726
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dc.contributor.authorBashir, Muhammad Sohail-
dc.contributor.authorSafdar, Aqsa-
dc.date.accessioned2019-10-25T10:15:03Z-
dc.date.available2019-10-25T10:15:03Z-
dc.date.issued2017-12-01-
dc.identifier.urihttp://142.54.178.187:9060/xmlui/handle/123456789/726-
dc.description.abstractSteady state complex heat transfer phenomenon across a cold storage composite wall has been studied by using COMSOL 5.0 Multiphysics simulation software. The layers of composite wall are built with three different materials, pine, cork board and concrete. Inside and outside surface temperatures of composite wall are T1 = 255K and T4 = 298 K respectively. Without including convective resistance heat flux value is 17.15 W/m2 and with convective resistance it is reduced to 12.12 W/m2. The temperature profiles in each composite layer are linear at constant thermal conductivities. But it has been observed that this trend is changed when thermal conductivities are the function of temperature. COMSOL Multiphysics simulator results are compared with analytical results.en_US
dc.language.isoen_USen_US
dc.publisherPakistan Journal of Engineering Technology and Scienceen_US
dc.subjectComposite Wallen_US
dc.subjectCOMSOLen_US
dc.subjectHeat Fluxen_US
dc.subjectTemperature Profileen_US
dc.subject.ddcEngineering and Technology-
dc.titleSimulation of Complex Heat Transfer Phenomenon across the Composite Wall by Using COMSOL Multiphysicsen_US
dc.typeArticleen_US
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