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Please use this identifier to cite or link to this item: http://173.208.131.244:9060/xmlui/handle/123456789/726
Title: Simulation of Complex Heat Transfer Phenomenon across the Composite Wall by Using COMSOL Multiphysics
Authors: Bashir, Muhammad Sohail
Safdar, Aqsa
Keywords: Composite Wall
COMSOL
Heat Flux
Temperature Profile
Issue Date: 1-Dec-2017
Publisher: Pakistan Journal of Engineering Technology and Science
Abstract: Steady state complex heat transfer phenomenon across a cold storage composite wall has been studied by using COMSOL 5.0 Multiphysics simulation software. The layers of composite wall are built with three different materials, pine, cork board and concrete. Inside and outside surface temperatures of composite wall are T1 = 255K and T4 = 298 K respectively. Without including convective resistance heat flux value is 17.15 W/m2 and with convective resistance it is reduced to 12.12 W/m2. The temperature profiles in each composite layer are linear at constant thermal conductivities. But it has been observed that this trend is changed when thermal conductivities are the function of temperature. COMSOL Multiphysics simulator results are compared with analytical results.
URI: http://173.208.131.244:9060/xmlui/handle/123456789/726
Appears in Collections:Journals

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